Edge Coating Agent for Package Substrates
By suppressing microscopic foreign substance generation and by increasing substrate strength, it reduces cracks and breakages.
The supervisors on package substrate fabrication sites are always trying to reduce defective products such as failures due to microscopic foreign substances generated from the substrate edges and cracks and breakages due to substrate handling. We recommend you to introduce our Edge Coating System for substrates. This system automatically applies our Package Substrate Edge Coating Agent on the 4 sides-edges of the substrate. Even after etching process, copperplate remains on the coating part, increasing the substrate strength.
